Michael Beimforde (MPI München)
The Max-Planck-Institute for Physics is developing a novel detector concept combining thin pixel sensors with a vertical integration technology. Thin devices are produced in a wafer bonding process developed by the MPI semiconductor laboratory and expected to show good radiation-hardness properties up to the fluences received at the Super LHC in the inner layers of the ATLAS tracker. The vertical integration technology ICV-SLID from the Fraunhofer IZM in Munich is investigated as a possible replacement of the bump bonding technology and allows for building compact pixel modules in which the signals can be extracted from the back side. This increases the active fraction of the modules as no inactive cantilevers need to be introduced at the module edges for wire bonding. As both, the sensors as well as the readout, chips are thinned the contribution to the material budget and hence the multiple scattering effects in the modules are reduced.
In this talk an overview of our R&D work for the novel module concept is given including the steps towards the first completed production of pixel sensors with an active thickness of 75μm and 150μm. Characterizations and charge collection measurements of unirradiated and proton irradiated sensors are presented and results of the efficiency of the SLID interconnection are shown.